| Type |
External |
STF Structure |
Features |
| Memory |
NAND |
 |
- Size : 12”
- Ceramic : 10~20 layers
- Via : 500,000~2,000,000
- Fhin film : 1 layers |
- DUT Density : Low
- DUT Number : High
- Touchdown : 1 |
| DRAM |
 |
- Size : 12”
- Ceramic : 20~25 layers
- Via : 1,000,000~2,000,000
- Fhin film : 2~4 layers |
- DUT Density : High
- DUT Number : High
- Touchdown : 1~5 |
| SystemIC |
SOC |
 |
- Size : 2”~4”
- Ceramic : 50~80 layers
- Via : 500,000~1,000,000
- Fhin film : 2~5 layers |
- DUT Density : Very high
- DUT Number : Low
- Touchdown : 200~500 |
| SystemLSI |
CIS |
 |
- Size : 5”~7”
- Ceramic : 43~96layers (internal electrode 60 layers till)
- Via : 160,000~1,600,000
- Fhin film : 1~5 layers |
- DUT Density : Very high
- DUT Number : Low
- Touchdown : 10~30
- Low Power Noise |
|